Single Die Packaging for ASIC

GigPeak provides a wide range of semiconductor packages for ASIC solutions to meet customer requirements. The packages offered are: Quad Flat Pack (PQFP, TQFP), Quad Flat No-lead (QFN), Ball-Grid-Array (PBGA, TFBGA, LBGA etc.), Flip Chip BGA (FCBGA), Ceramic (CDIP, CLCC, CPGA etc.), Stacked & MCM. GigPeak engineers work with customer engineers to provide the best packaging solution for performance & cost.

With more I/O connections being added to SOC’s and due to ease of manufacturing in surface mount production, Ball Grid Array (BGA) packages have become the package of choice for high pin-count designs. GigPeak ASIC engineers have experience in working with customers and package designers to undertake custom substrate designs and conduct thermal & electrical analysis to provide a high quality packaging solution.

Stacked die packaging & MCM’s allows mounting of different ICs in a single package. These solutions include ASIC, NVRAM, Analog chips etc. to optimize overall solution.